Development of the CPU Board for next generation ADAS / Infotainment solution for Chinese Tier 1 OEM

• • • •   Complete HW Architecture, Schematic Design, BOM Generation, Board Bringup & Validation
      •   Support for Manufacturing, Compliance testing
      •   16 layer CPU Board
      •   TI Jacinto 6 (DRA756) based CPU Board design
      •   DDR3 (up to 4GB), EMMC (up to 32GB) , SD Card Interface
      •   Support for 4 different LCD Display modules (IVI, DIC, RV & HUD) through Serializers
      •   Support for 8 HD Camera (AVM, Face ID, DVR etc) and 4 Analog Camera
      •   Support options for 4G, WiFi, BT, USB Ports (3) with BC1.2Development of Management IO card for a Security Services Product (SSP) for US Networking Major
        
        •   SSP has 3 CPU Blades, 1 MIO Card, 1 Midplane, 2 redundant PSU & 4 redundant fans
        •   MIO card is based on Intel Quad core processor (Gladden) and PCH (Cavecreek). It also has 1.28Tbps Trident-II switch from Broadcom.
        •   MIO Interfaces to 3 CPU Blades through this Ethernet switch. On the Front panel, it supports two pluggable EPM slots and 8 fixed SFP+ ports. EPM cards support 8x10G or 4x40G ports.
        •   MIO card is 18 layer board with 10Gbps high speed signals all over the board
        •   Development of PSEQ SW for the complete MIO Card
        •   Design Verification test and Regulatory compliance tests as per FCC/CISPER standardsDevelopment of the complete In-Flight Entertainment Server according to ARINC600 4 MCU Module Standards for a European Avionics Major
          
          •   Modularized boards (CPU Board, IO Board, PSU Board & Backplanes)
          •   CPU Module (12 layer board)

•     – Two enterprise grade SATA SSDs. One for OS / applications (32GB) and other for Video/Music Entertainment content (256GB to 1 TB)

•     – 3x 7 Port Gigabit Ethernet Switches from Marvell (88E6351)

•     – Provides 8 GigE (1 Front Panel, 1 CPU/IO board communication, 4 to Seat Display Unit, 1 Data Loading Port and 1 PoE port), 6 FE interfaces (to Backplane).

•     – 3 HD Audio interface at Backplane and USB, UART and LEDs at the front panel.

• • • •   IO Board (12 layer board)

      – IO Board is based on MPC8278E processor. It supports up to two DDR II memory chips in x32 configuration.

•     – 3 ARINC 429 controllers in Local bus which support 6 Rx channels and 3 Tx channels

•     – 8 ARINC 485 channels using two Quad UART controllers in SPI port

•     – 16 Rx and 7 Tx ARINC 720 interfaces using IO Expanders in I2C port

• • • •   PSU board (6 layer board)

      – Receives the 115V AC, 360 Hz to 800 Hz from source

•     – Provides Input spikes protection and EMI filtering at AC side

•     – AC/DC PFC section provides inrush protection, Power Factor Correction, High Voltage DC Conversion (300V). Output Capacitor provides steady DC o/p and hold up of up to 200ms

•     – Provides 12V DC to CPU/IO boards through isolated DC-DC flyback converter with short circuit protection

• • • •   Backplane (8 layer board) Interconnects all the different boards (CPU, IO & PSU).
      •   Qualification of the unit as per RTCA DO-160E standards
      • NPI of a 4G capable OBD-connected vehicle tracking device
        
        •   System architecture
        •   Component selection
        •   Schematic Design
        •   Board Bring-up & Diagnostics
        •   Complete S/W development
        •   Device Characteristics

      – STM Cortex-M4 based main board

•     – OBD control via ELM327

•     – 4G module from QUECTEL

•     – BT/WIFI module from QUECTEL

•     – On-board accelerometer, gyroscope, pressure, temperature sensors

•     – Li-Po battery charger and Fuel Gauge

•     – PMIC with BUCK, Boost and LDOs

•     – 2 board solution : 4-layer PCB

•     – Mechanical (Plastic) Enclosure design (by partner)

    – Low Volume Production ramp by week 24